Ranking Profile - Chipbond Technology Corporation

Introduction

Chipbond Technology Corp (Chipbond Technology) is a provider of supplying turnkey services for backend assembly processing of liquid crystal display (LCD) driver integrated circuits (ICs). It provides turnkey services, bumping manufacturing services such as gold, solder and copper bumping, redistribution layer (RDL) service, wafer surfaces processing services such as backside metal process and dielectric layer coating process, wafer grinding, dicing and pick and place service, and chip tray design and manufacturing services. Chipbond Technology also provides package and test services such as driver IC testing, non-Driver IC testing, and driver IC package service (COF), and final inspection and failure analysis services. Its plants are located in Hsinchu and Kaohsiung, Taiwan. Chipbond Technology is headquartered in Hsinchu, Taiwan.